Liquid Cooling Products (LCP)
Liquid Cooling Products provide a range of water and refrigerant based open and closed loop cooling solutions that easily achieve 50% energy savings! Thanks to intelligent control and the flexibility to add additional fans, partial load efficiencies can increase energy savings of up to 50% at the same volumetric flow and constant cooling output.
Close Coupled
• Shortest distance to heat exchanger from IT components
• Reduced possibility of cool air heated on way to the IT load
Fully controlled operational parameters
• Better planning for scalability and safety capacities
• Automatic adjusting of fan speed and water flow during operation
Recovery management with automatic door opening
• Release heat load into space (Thermal Ride Thru)
Climate Control Configuration
• Low Density to 10kW
• Mid Density 10-20kW
• High Density >20kW to 60KW
Easy Deployment and Operations
• Easily achieve 50% energy savings
• Very low noise emission with solid doors (Closed Loop)
• Uneven distribution of IT load possible; highest guarantee of functionality
• HContainment and raised floor not required
Blue e+
A revolution in energy efficiency through innovative hybrid technology
Unbelievable efficiency
• Active cooling circuit with speed-regulated components for demand based cooling
• Integral heat pipe for passive cooling
Amazingly economical
• Energy savings of up to 75%
Versatility
• Suitable for international use due to multi-voltage support
High Performance Cooling Products (HPC) – Zutacore
Rittal has combined its traditional and OCP cabinets with an innovative direct-on-chip evaporative cooling solution from Zuta Core to meet and surpass the challenges posed by server-level hot spots and high-performance-computing requirements. Using an advanced close devaporative Nucleation Evaporator technology which allows cooling of high-powered process or above 900W. Additionally,this system provides capabilities for advanced IoT monitoring and management of server performance and cooling system maintenance. The minimal additional space (RHx door or in-rack HRU). Has the benefits of:
No chilled water-cooling system required to remove the high heat load:
• The direct-on-chip system uses a non-conductive refrigerant, eliminating water inside the rack.
Easily deployed without modifying existing infrastructure and easy maintenance:
• Installation of high-powered computing nodes in an existing data center facility served by a traditional room cooling technology.
